The heat spreader transfers heat from the SoC and onboard components to the VPX chassis. The chassis should provide sufficient cooling to dissipate the heat, either through fan, heat sink, or cold plate/cold wall, depending on the thermal capability of the chassis.
For further product inquiries, please get in touch with our sales team at mktg@iwave-global.com
Please find the detailed product information here:
Agilex® 9 Direct RF 3U VPX Plug-in Module