The Versal™ AI Edge SOM G57M utilizes the TIC805A from Ziitek, thermal pad is used between the Versal SOM and its heatsink. This material is selected for its high thermal performance.
For active cooling, the system is equipped with the iW-FSKALU-CLASLR-CU09-DS integrated fan-sink. Detailed specifications for both components can be found in the references below:
Thermal Pad (Ziitek TIC805A):
Low-Melting CPU Gray 2.5W Phase Changing Materials PCM For Power Conversion Equipment
Fan-Sink (iWave): Attached iW-FSKALU-CLASLR-CU09 datasheet for reference.
iW-FSKALU-CLASLR-CU09.pdf (1.4 MB)
For further product inquiries, please get in touch with our sales team at mktg@iwave-global.com
Please find the detailed product information here:
Versal™ AI Edge System on Module