This category covers high-density, SOSA™-aligned 3U OpenVPX payload processing cards powered by the Altera Agilex™ 7 F-Series SoC FPGA in the R24C package (supporting AGF006 up to AGF027 variants).
Unlike general-purpose host CPUs or network switch boards, Payload Profile modules serve as the heavy primary compute engine inside a 3U VPX chassis. Pairing up to 2.7M logic elements with a built-in Quad-core Arm CPU and ultra-high-density memory, these boards deliver extreme DSP, electronic warfare, and sensor processing performance.
Key Highlights
-
Silicon Architecture (Agilex 7 R24C):
-
FPGA Fabric: Up to 2.7 million Logic Elements with high-throughput DSP blocks.
-
Hard Processor System (HPS): Quad-core Arm® Cortex®-A53 (up to 1.5 GHz) running embedded Linux for standalone system control .
-
-
Ultra-High Memory Density:
-
Dual independent 64-bit banks of DDR4 with ECC (8GB for HPS + 8GB for FPGA logic ).
-
Ultra-low-latency dual 144Mb QDR-IV SRAM banks for rapid packet lookups and FIFO queui ng.
-
32GB onboard eMMC + QSPI Flash for boot stor age.
-
-
High-Speed OpenVPX Interconnects:
-
Data Plane: 40GBASE-KR4 / 10GBASE-KR fat pipes for multi-gigabit strea ming.
-
Expansion Plane: Dual PCIe Gen3 x8 links for high-bandwidth backplane transfers.
-
Optical & Video I/O: Backplane aperture (VITA 66.5 / MT Ferrule) supporting 12-channel fiber links (FireFly) alongside coaxial SDI video inputs/ou tputs.
-
-
SOSA™ Slot Alignment: Compliant with standardized SOSA payload profiles (e.g.,
SLT3-PAY-1F1U1S1S1U1U4F1J) and equipped with a Tier-3 VITA 46.11 Board Management Controller (IPMC).
Please find the detailed product information here:
Agilex™ 7 (R24C) SOSA-aligned 3U VPX Plug-in Module (Payload Profile)