Unlike traditional FPGA boards that require separate ADC/DAC daughter cards (like FMC+), these modules leverage direct RF sampling silicon. They integrate wideband, high-speed Analog-to-Digital (ADC) and Digital-to-Analog (DAC) converters directly onto the FPGA package. This eliminates analog interface bottlenecks and dramatically reduces latency, power, and board area for demanding Electronic Warfare (EW), Radar, and SIGINT applications.
Key Highlights
-
Integrated Direct RF Sampling: On-chip multi-channel ADCs and DACs operating at ultra-high sample rates (e.g., up to 64 Gsps DAC / 32 Gsps ADC or multi-channel 16/24 Gsps) for direct sampling up to Ka-band frequencies.
-
Massive Compute & Processing System (PS):
-
High-density 10nm/Intel 7 Agilex fabric with integrated Hard Processor System (HPS) featuring Quad-core Arm® Cortex®-A53 cores.
-
Massive DSP performance with hardened Tensor blocks for real-time AI/ML signal processing.
-
-
High-Speed Interconnects: PCIe Gen4 / Gen5 support, 100G/200G Ethernet, and high-speed transceivers routed across the VPX backplane.
-
SOSA™ Alignment: Standardized 3U OpenVPX payload slot profiles with high-density blind-mate RF apertures (VITA 67.3 NanoRF) and optical interfaces (MT Ferrule) for direct coaxial/fiber backplane connections.
Please find the detailed product information here:
Agilex® 9 Direct RF 3U VPX Plug-in Module