The Kintex UltraScale / UltraScale+ (KU19P / KU095 / KU115) Payload Profile refers to high-performance, open-architecture FPGA computing modules designed primarily for 3U VPX and SOSA™ (Sensor Open Systems Architecture) aligned embedded systems.
These boards act as primary “Payload Modules”—the workhorses responsible for high-throughput digital signal processing (DSP), real-time sensor processing, and high-speed data routing in aerospace, defense, radar, and electronic warfare (EW) applications.
Key Processing Hardware
This category leverages AMD/Xilinx’s top-tier mid-range and high-density FPGAs:
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Kintex UltraScale (KU095, KU115): Known for exceptionally high DSP slice-to-logic ratios (the KU115 packs up to 5,520 DSP slices), making them ideal for heavy mathematical workloads like beamforming, channelization, and encryption.
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Kintex UltraScale+ (KU19P): Built on a 16nm process, offering up to 1.84 million logic cells and higher power efficiency along with high-speed GTY transceivers .
Please find the detailed product information here:
Kintex™ UltraScale+™ FPGA 3U VPX Plug-in Module (Payload Profile)