About the MPSoC ZU19/ZU17/ZU11 SBC (Payload Profile) category

This category covers the highest-performance Single Board Computers (SBCs), System-on-Modules (SoMs), and 3U/6U OpenVPX (SOSA™-aligned) payload modules built on the Zynq® UltraScale+™ MPSoC EG family (C1760 packages).

Sitting at the absolute top of the MPSoC spectrum, these boards feature up to 1.1 million Logic Cells, 32 GTH transceivers, and 16 ultra-fast GTY transceivers (up to 32.7 Gbps). They are engineered for massive parallel compute, high-throughput network switching, and heavy optical backplane communication where standard edge SoMs hit a ceiling.

What Can Be Discussed in This Forum

1. Hardware Architecture & Thermal Management

  • VPX Slot/Module Profiles: Implementing VITA 65 / SOSA™-aligned payload and switch profiles for chassis integration.

  • Thermal Solutions: Managing heavy thermal loads using conduction cooling, wedge-locks, and heat-spreaders in high-power setups.

  • High-Speed PCB Layout: Signal integrity challenges when routing 32.7 Gbps GTY transceivers and dual 64-bit PL DDR4 memory banks.

2. Firmware, DSP, and AI Acceleration

  • FPGA Logic Scaling: Partitioning large DSP algorithms, radar pipelines, or 100G networking stacks across 1M+ logic cells.

  • Multi-OS Execution: Running Linux on Cortex-A53 alongside real-time OS (VxWorks/FreeRTOS) on Cortex-R5 cores.

  • AI/ML Inference: Implementing the DPU (Deep Learning Processing Unit) for multi-camera video analytics and intelligent sensor fusion.

3. High-Speed Interconnects & Protocol IP

  • High-Bandwidth Networking: Integrating 100G Ethernet, PCIe switches, NVMe storage controllers, and sFPDP IP.

  • FMC+ Expansion: Interfacing ultra-high-speed external ADC/DAC daughter cards via VITA 57.4 FMC+ HPC connectors.

Please find the detailed product information here:
3U VPX based Zynq Ultrascale+ ZU19/ZU17/ZU11EG SBC with FMC+