The iG-G35M SOM is fabricated using TU883Sp (ThunderClad 2 Sp) high-performance PCB material from TUC.
To further optimize signal integrity for high-speed transceiver signals, back-drilled vias are implemented. This manufacturing process removes unused via stubs, significantly reducing parasitic capacitance and signal reflections at multi-gigabit data rates.
For further product inquiries, please get in touch with our sales team at mktg@iwave-global.com
Please find the detailed product information here:
Zynq™ UltraScale+™ ZU19/ZU17/ZU11 MPSoC System on Module